AVI has published 19 papers at industry symposia and trade magazines worldwide with companies including Samsung, Intel, TSMC, UMC, KLA-Tencor, Photronics, and PSMC.
27 patents have been issued to AVI as a result of our innovative solutions to solving customers' problems.
Improving reticle defect disposition via fully automated lithography simulation
Samsung, AVI. Presented at SPIE Microlithography 2016 PDF
Automatic Classification and Defect Verification Based on Inspection Technology with Lithography Simulation
DNP, AVI. Presented at BACUS 2015 PDF
Increasing reticle inspection efficiency and reducing wafer print-checks at 14nm using automated defect classification and simulation
Samsung, AVI, PKL, Photronics. Presented at BACUS 2014 PDF
Improved reticle requalification accuracy and efficiency via simulation-powered automated defect classification
Samsung, AVI, Photronics. Presented at SPIE Microlithography 2014 PDF
Increasing reticle inspection efficiency and reducing wafer print-checks using automated defect classification and simulation
Samsung, AVI. Presented at BACUS 2013 PDF
Autoclassification and simulation of mask defects using SEM and CAD images
TSMC, Holon, AVI. Presented at BACUS PDF
Optimal Defect Specs
AVI. Presented at BACUS PDF
ADAS for Increasing Mask Shop Productivity
AVI and Photronics. Presented at Photomask Japan PDF
Improved Method for Measuring and Assessing Reticle Pinhole Defects for the 100nm Lithography Node
By Darren Taylor, Photronics; and Anthony Vacca, Larry Zurbrick, KLA-Tencor. Presented at Photomask Japan HTML PDF
Mask Defect Disposition: Flux-Area Measurement of Edge, Contact, and OPC Defects Correlates to Wafer and Enables Effective Decisions
By Peter Fiekowsky, Automated Visual Inspection; Darren Taylor, Photronics; David Wang, C.C. Yang, S.C. Lin, PSMC Taiwan; and L.H. Tu, K.R. Lin, UMC Taiwan. Presented at Photomask Japan HTML PDF
Contact Holes: Optical Area Measurement Predicts Printability and is Highly Repeatable
By Glen Scheid, LSI Logic Corp.; Darren Taylor, Photronics; and Peter Fiekowsky, Automated Visual Inspection. Presented at Photomask Japan HTML
New Optical Metrology for Masks: Range and Accuracy Rivals SEM
By Rand Cottle, Photronics; Peter Fiekowsky, Automated Visual Inspection; and C.C. Hung, S.C. Lin, TSMC Taiwan. Presented at Photomask Japan HTML PDF
Feed Forward Modeling and Control on a Contact Masking Process
By G. W. Scheid, A. Kang, LSI Logic Corp.; Peter Fiekowsky, Automated Visual Inspection. Presented at the 26th Annual International Symposium on Microlithography
Soft Defect Printability: Correlation to Optical Flux-Area Measurements
By Darren Taylor, Photronics and Peter Fiekowsky, Automated Visual Inspection. Presented at the SPIE 20thAnnual BACUS Symposium on Photomask Technology and Management, Conference 4186 HTML PDF
Optical Reticle Metrology for Subwavelength Lithography
Published in Microlithography World
The End of Thresholds: Subwavelength Optical Linewidth Measurement Using the Flux-Area Technique
By Peter Fiekowsky, Automated Visual Inspection. Presented at Photomask Japan HTML PDF
Technique Brings More Certainty to Mask Measurements
Published in Solid State Technology, Volume 42, Issue 4
Defect Printability Measurement in the KLA-351: Correlation to Defect Sizing Using the AVI Metrology System
By Peter Fiekowsky, Automated Visual Inspection and Daniel Selassie, Intel Corporation. Presented at the SPIE 19th Annual BACUS Symposium on Photomask Technology and Management HTML PDF
Optical Measurement of Sub-0.5 Micron Defects and CDs
By Peter Fiekowsky, Automated Visual Inspection. Published in Bacus News, Volume 14, Issue 4
Accurate and Repeatable Mask Defect Measurements for Quarter-Micron Technology
By Peter Fiekowsky, Automated Visual Inspection. Presented at the SPIE 17th Annual BACUS Symposium on Photomask Technology and Management
— For a complete list or copies, please contact Anthony Vacca @ 512-699-5507 or tony@aviphotomask.com